PA - Systementwurf einer modularen FPGA-Architektur für Elektrische Impedanztomographie
Systementwurf einer modularen FPGA-Architektur für Elektrische Impedanztomographie
System Engineering of a Modular FPGA-Based Data Processing Architecture for Electrical Impedance Tomography (EIT)
Objective:
Deliver a parametric and modular solution for configuring an FPGA-based data acquisition and processing system for EIT. The tool allows users to input system design parameters and receive an automatically derived, constraint-compliant system configuration — from hardware modules to protocols and memory layout.
Deliverables Overview
1. Modularization of System Architecture
Goal: Define a flexible and scalable system structure that supports a hierarchy of components.
Subtasks:
Partitioning of system responsibilities across a Main FPGA and multiple Slave FPGAs
Modular definition of:
Stimulation units
Data acquisition channels
Communication interfaces
Processing pipelines
Interface abstractions for arising communication
Hierarchical control and synchronization structure
2. Parametrization Framework
Goal: Formalize all design-critical variables and their interdependencies.
Subtasks:
Define input parameters:
Number of electrodes/modules
ADC/DAC resolution and sampling rate
Interface protocol options
Power, logic, and throughput constraints
Processing stages to be handled on FPGA vs. PC
Construct dependency models:
Bitrate as function of ADC/sample rate/module count
RAM usage vs. number of buffers and sampling windows
Latency models based on data paths
Build validation logic:
Resource feasibility
Bandwidth and timing compliance
3. Optional Frontend Interface
Goal: Provide a software interface to enter parameters, enforce constraints, and return valid system configurations.
Subtasks:
Design GUI and/or CLI
Validate inputs against defined system constraints
Automatically compute:
Required number of modules
Interface bandwidth
Memory allocations
Control architecture
Generate:
Visual block diagrams
Documentation snippets
HDL module instantiations or configuration files
Export functionality:
Export the derived setup in a suitable manner
Name: | @Sai Bhavani |
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Thesis Type MA/BA/PA: | PA |
Student ID / Matrikelnummer: | 610995 |
Field of Study / Studiengang: | Microelectronics |
Official start-date / Offizieller Beginn: | Apr 29, 2025 |
Final-report-due /Abgabe: | Aug 19, 2025 |
Spotlight-presentations: |
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Finale presentation / Abschlusspräsentation |
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Zweitprüfer / Second Examiner | @Moritz Hollenberg |
Confidential / Vertraulich | No |
Checklist
Introduction / tour in M4
Urheberrechtsvereinbarung signed: https://www.tuhh.de/t3resources/sls/pdf/ZPA/Formulare_oeffentlich/Rechte_an_Abschlussarbeiten.pdf
if applicable: signed confidential agreement
official registration
Helpful links:
Document Upload Final Thesis / Dokumentenabgabe Abschlussdokument
File of final presentation / Dokumentenabgabe Abschlusspräsentation
Link for further files / Link für weitere Dokumente
Institut für Mechatronik im Maschinenbau (iMEK), Eißendorfer Straße 38, 21073 Hamburg